| Publication CODE |
Title |
| NBN EN IEC 61188-6-2:2021 (2021-03) |
CIRCUIT BOARDS AND CIRCUIT BOARD ASSEMBLIES - DESIGN AND USE - PART 6-2: LAND PATTERN DESIGN - DESCRIPTION OF LAND PATTERN FOR THE MOST COMMON SURFACE MOUNTED COMPONENTS (SMD) |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
14.00 €
|
3. |
Description
IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191'2:2017.
|
| Class |
C
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
|
|
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
CLC/SR 91
Electronics assembly technology
|
| BEC Approval |
2021-03-11 |
| NBN Approval |
2021-03-17 |
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2021-03-11 |
| Date of announcement (d.o.a.) |
2021-06-11 |
| IEC file modification date |
2021-03-13 |
|
