Publication details
Publication CODE |
Title |
NBN EN IEC 60068-2-20:2021 (2021-05) |
ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST TA AND TB: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
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Price Excl. VAT |
Total number of pages, tables and drawings |
14.00 €
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3. |
Description
IEC 60068-2-20:2021 is available as IEC 60068-2-20:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60068-2-20:2021 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068'2'58. This document provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this document include the solder bath method and soldering iron method. The objective of this document is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can be resistant to the heat load to which it is exposed during soldering. This edition includes the following significant technical changes with respect to the previous edition:
- update of and clarification of pre-conditioning (former "aging") and its relation to natural aging.
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Class |
C
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Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
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DE version
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EN version
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FR version
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Status
Status |
IEC PUBLICATION |
Situation |
Currently active
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Origin
Committee |
CLC/SR 91
Electronics assembly technology
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Approval
BEC Approval |
2021-05-04 |
NBN Approval |
2021-05-13 |
NBN Status |
New |
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Date of ratification (d.o.r.) |
2021-05-04 |
Date of announcement (d.o.a.) |
2021-08-04 |
IEC file modification date |
2021-05-08 |
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