| Publication CODE |
Title |
| IEC 60749-19:2003+AMD1:2010 CSV (2010-11) |
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 19: DIE SHEAR STRENGTH |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
42.00 €
|
13 P. |
Description
IEC 60749-19:2003+A1:2010 determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates.
This consolidated version consists of the first edition (2003)
and its amendment 1 (2010). Therefore, no need to order amendment in
addition to this publication.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2010-11-29 |
| Registration |
107921 |
| ICS-Code (International Standards Classification) |
31.080.01
|
| NBN Status |
New |
|
| IEC publication date |
2010-11-29 |
| IEC stability date |
2025-12-31 |
| IEC last modification date |
2018-11-22 |
|
