| Publication CODE |
Title |
| NBN EN 60749-21:2006 (2005-02) |
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS
PART 21: SOLDERABILITY |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
25.00 €
|
2 P. |
Description
Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
|
| Class |
C86
(ELECTRONIC COMPONENTS MICRO ELECTRONICS - DISCRETE SEMICONDUCTORS)
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
Very important notice: 98% of the text of the NBN EN 55XXX,
NBN EN 6XXXX comes from the IEC text which is NOT included.
This text can be ordered here:
IEC 60749-21:2004.
For the series NBN EN 50XXX, the standards are however complete.
|
EN version
|
FR version
|
NL version
|
DE version
|
|
| Status |
Registered trilingual Belgian standard EN or FR or DE |
| Situation |
Withdrawn
Replaced by
NBN EN 60749-21:2011
|
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2004-12-07 |
| NBN Approval |
2006-05-15 |
| Registration |
65409 |
| ICS-Code (International Standards Classification) |
31.080
|
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2004-12-07 |
| Date of availability (d.a.v.) |
2005-02-15 |
| Date of announcement (d.o.a.) |
2005-03-01 |
| Date of publication (d.o.p.) |
2005-09-01 |
| Date of withdrawal former edition (d.o.w.) |
2008-01-01 |
|
