| Publication CODE |
Title |
| IEC 61190-1-2:2007 (2007-04) |
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS in ELECTRONICS ASSEMBLY |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
122.00 €
|
37 P. |
Description
IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
Available files
|
EN version
|
DE version
|
FR version
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2007-04-01 |
| ICS-Code (International Standards Classification) |
35.040
|
|
| IEC publication date |
2007-04-26 |
| IEC stability date |
2013-12-31 |
| IEC last modification date |
2014-02-19 |
|
