Publication CODE |
Title |
NBN EN 62137-1-3:2009 (2009-02) |
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT
PART 1-3: CYCLIC DROP TEST |
|
Price Excl. VAT |
Total number of pages, tables and drawings |
25.00 €
|
3 P. |
Description
Applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs).
This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.
|
Class |
C90
(TELECOMMUNICATIONS - ELECTRONIC GENERAL)
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
Very important notice: 98% of the text of the NBN EN 55XXX,
NBN EN 6XXXX comes from the IEC text which is NOT included.
This text can be ordered here:
IEC 62137-1-3:2008.
For the series NBN EN 50XXX, the standards are however complete.
|
DE version
|
EN version
|
FR version
|
NL version
|
|
Status |
Registered trilingual Belgian standard EN or FR or DE |
Situation |
Currently active
|
|
Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
Responsible |
De heer VAN HECKE Luk
|
BEC Approval |
2009-02-01 |
NBN Approval |
2009-10-30 |
Belgian Official Journal |
2009-12-09 |
Registration |
96467 |
ICS-Code (International Standards Classification) |
31.190
|
NBN Status |
New |
|
Date of ratification (d.o.r.) |
2009-02-01 |
Date of availability (d.a.v.) |
2009-02-20 |
Date of announcement (d.o.a.) |
2009-05-01 |
Date of publication (d.o.p.) |
2009-11-01 |
Date of withdrawal former edition (d.o.w.) |
2012-02-01 |
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