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Publication details

Publication CODE Title
IEC TR 62878-2-8:2021 (2021-07) DEVICE EMBEDDING ASSEMBLY TECHNOLOGY - PART 2-8: GUIDELINES - WARPAGE CONTROL OF ACTIVE DEVICE EMBEDDED SUBSTRATE
 
Price Excl. VAT Total number of pages, tables and drawings
85.00 € 14.
Description
IEC TR 62878-2-8:2021(E) describes a warpage control of active device embedded substrate along with parameters for determining warpage, which are useful during package assembly. Warpage results are explained using warpage driving force, resistance and neutral axis, for typical die embedded substrate, where the discrete active dies are placed in the core of substrate and interconnected to the substrate by direct Cu bonding. The same principles are applicable in other device embedded substrates. Even though the detailed structure of other device embedded substrates might be different, the origin and determination of the parameters of warpage are the same and thus the purpose of this report is to help engineers improve the warpage behaviours of their products by applying this principle.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN version

Status
Status IEC PUBLICATION
Situation Currently active
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2021-07-07
ICS-Code (International Standards Classification) 31.180 , 31.190
NBN Status New
IEC publication date 2021-07-07
IEC stability date 2025-12-31
IEC file modification date 2021-07-07
IEC last modification date 2021-07-07