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Publication details

Publication CODE Title
IEC PAS 62170:2000 (2000-08) BOND WIRE MODELING STANDARD
 
Price Excl. VAT Total number of pages, tables and drawings
85.00 € 12.
Description
Standardizes the first order modeling of bond wires and the way bond wires are modeled in three dimensional electromagnetic field solvers. Describes the modeling of a bond wire from an integrated circuit die to a package lead in a ball or wedge type wire bond configuration.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN version

Status
Status IEC PUBLICATION
Situation Withdrawn
Origin
Committee TC 47
SEMICONDUCTOR DEVICES
Responsible Ir DELENS Marc
Approval
BEC Approval 2000-08-24
ICS-Code (International Standards Classification) 35.040
NBN Status New
IEC publication date 2000-08-24
IEC last modification date 2004-05-17