| Publication CODE |
Title |
| IEC 60749-14:2003 (2003-08) |
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY) |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
27. |
Description
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly.
Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2003-08-07 |
| ICS-Code (International Standards Classification) |
31.080.01
|
|
| IEC publication date |
2003-08-07 |
| IEC stability date |
2024-12-31 |
| IEC last modification date |
2019-11-20 |
|
