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Publication details

Publication CODE Title
IEC PAS 62174:2000 (2000-08) RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
 
Price Excl. VAT Total number of pages, tables and drawings
21.00 € 5.
Description
Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN version
Status
Status IEC PUBLICATION
Situation Withdrawn
Origin
Committee TC 47
SEMICONDUCTOR DEVICES
Responsible Ir DELENS Marc
Approval
BEC Approval 2000-08-22
ICS-Code (International Standards Classification) 35.040
NBN Status New
IEC publication date 2000-08-22
IEC last modification date 2009-08-18