| Publication CODE |
Title |
| IEC 60191-4:2013+AMD1:2018 CSV (2018-03) |
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 4: CODING SYSTEM AND CLASSIFICATION INTO FORMS OF PACKAGE OUTLINES FOR SEMICONDUCTOR DEVICE PACKAGES |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
318.00 €
|
152. |
Description
IEC 60191-4:2013+A1:2018 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use. This consolidated version consists of the third edition (2013) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47/SC 47D
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2018-03-27 |
| ICS-Code (International Standards Classification) |
31.080.01
|
| NBN Status |
New |
|
| IEC publication date |
2018-03-27 |
| IEC stability date |
2023-12-31 |
| IEC file modification date |
2018-03-27 |
| IEC last modification date |
2018-03-27 |
|
