| Publication CODE |
Title |
| IEC TR 63378-1:2021 (2021-12) |
THERMAL STANDARDIZATION ON SEMICONDUCTOR PACKAGES - PART 1: THERMAL RESISTANCE AND THERMAL PARAMETER OF BGA, QFP TYPE SEMICONDUCTOR PACKAGES |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
122.00 €
|
20. |
Description
IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47/SC 47D
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2021-12-14 |
| ICS-Code (International Standards Classification) |
31.080.01
|
| NBN Status |
New |
|
| IEC publication date |
2021-12-14 |
| IEC stability date |
2026-12-31 |
| IEC file modification date |
2021-12-14 |
| IEC last modification date |
2021-12-14 |
|
