| Publication CODE |
Title |
| IEC 60191-5:1997 (1997-04) |
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 5: RECOMMENDATIONS APPLYING TO INTEGRATED CIRCUIT PACKAGES USING TAPE AUTOMATED BONDING (TAB) |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
249.00 €
|
71. |
Description
Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 47/SC 47D
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
1997-04-23 |
| ICS-Code (International Standards Classification) |
31.080.01
|
|
| IEC publication date |
1997-04-23 |
| IEC stability date |
2020-12-31 |
| IEC last modification date |
1998-08-31 |
|
