| Publication CODE |
Title |
| IEC 60191-6-2:2001 (2001-12) |
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-2: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICES PACKAGES - DESIGN GUIDE FOR 1,50 mm, 1,27 mm AND 1,00 mm PITCH BALL AND COLUMN TERMINAL PACKAGES |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
42.00 €
|
10 P. |
Description
IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47/SC 47D
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2001-12-11 |
| ICS-Code (International Standards Classification) |
31.080.01
|
|
| IEC publication date |
2001-12-11 |
| IEC stability date |
2020-12-31 |
| IEC last modification date |
2012-12-11 |
|
