| Publication CODE |
Title |
| IEC 60191-6-4:2003 (2003-06) |
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF BALL GRID ARRAY (BGA) |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
16 P. |
Description
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47/SC 47D
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2003-06-11 |
| ICS-Code (International Standards Classification) |
31.080.01
|
|
| IEC publication date |
2003-06-11 |
| IEC stability date |
2020-12-31 |
| IEC last modification date |
2012-12-11 |
|
