| Publication CODE |
Title |
| IEC 60191-6-6:2001 (2001-03) |
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE PITCH LAND GRID ARRAY (FLGA) |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
12 P. |
Description
IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47/SC 47D
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2001-03-22 |
| ICS-Code (International Standards Classification) |
31.080.01
|
|
| IEC publication date |
2001-03-22 |
| IEC stability date |
2021-12-31 |
| IEC last modification date |
2019-01-10 |
|
