| Publication CODE |
Title |
| IEC 60191-6-12:2002 (2002-06) |
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-12: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE-PITCH LAND GRID ARRAY (FLGA) - RECTANGULAR TYPE |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
122.00 €
|
20. |
Description
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 47/SC 47D
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2002-06-14 |
| ICS-Code (International Standards Classification) |
35.040
|
|
| IEC publication date |
2002-06-14 |
| IEC last modification date |
2011-06-08 |
|
