| Publication CODE |
Title |
| IEC 60191-6-13:2007 (2007-06) |
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (FBGA/FLGA) |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
29. |
Description
IEC 60191-6-13:2007 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 47/SC 47D
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2007-06-27 |
| ICS-Code (International Standards Classification) |
31.080.01
|
|
| IEC publication date |
2007-06-27 |
| IEC stability date |
2017-12-31 |
| IEC last modification date |
2016-09-27 |
|
