| Publication CODE |
Title |
| IEC PAS 60191-6-19:2008 (2008-01) |
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
159.00 €
|
22. |
Description
This PAS stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 47/SC 47D
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2008-01-22 |
| ICS-Code (International Standards Classification) |
35.040
|
|
| IEC publication date |
2008-01-22 |
| IEC last modification date |
2010-02-25 |
|
