| Publication CODE |
Title |
| NBN EN 60191-6-19:2010 (2010-05) |
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
PART 6-19: MEASUREMENT METHODS OF THE PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
25.00 €
|
3 P. |
Description
Specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.
|
| Class |
C93
(TELECOMMUNICATIONS - ELECTRONIC PASSIVE ELECTRONIC COMPONENTS AND OPTICAL FIBRES (SEE ALSO C90))
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
Very important notice: 98% of the text of the NBN EN 55XXX,
NBN EN 6XXXX comes from the IEC text which is NOT included.
This text can be ordered here:
IEC 60191-6-19:2010.
For the series NBN EN 50XXX, the standards are however complete.
|
EN version
|
FR version
|
DE version
|
|
| Status |
Registered trilingual Belgian standard EN or FR or DE |
| Situation |
Currently active
|
|
| Committee |
TC 47/SC 47D
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2010-05-01 |
| NBN Approval |
2010-07-30 |
| Belgian Official Journal |
2010-08-19 |
| Registration |
106947 |
| ICS-Code (International Standards Classification) |
31.080.01
|
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2010-05-01 |
| Date of availability (d.a.v.) |
2010-05-21 |
| Date of announcement (d.o.a.) |
2010-08-01 |
| Date of publication (d.o.p.) |
2011-02-01 |
| Date of withdrawal former edition (d.o.w.) |
2013-05-01 |
|
