| Publication CODE |
Title |
| IEC 60191-6-17:2011 (2011-01) |
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-17: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR STACKED PACKAGES - FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (P-PFBGA AND P-PFLGA) |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
201.00 €
|
53 P. |
Description
IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47/SC 47D
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2011-01-27 |
| Registration |
115128 |
| ICS-Code (International Standards Classification) |
31.080.01
|
| NBN Status |
New |
|
| IEC publication date |
2011-01-27 |
| IEC stability date |
2021-12-31 |
| IEC last modification date |
2019-01-10 |
|
