| Publication CODE |
Title |
| IEC 60191-6-12:2011 (2011-06) |
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-12: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDELINES FOR FINE-PITCH LAND GRID ARRAY (FLGA) |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
122.00 €
|
37 P. |
Description
IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition:
- scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: "Rectangular type" has been deleted from the title;
- ball pitch of 0,3 mm has been added;
- datum is changed from the body datum to the ball datum;
- combination lists of D, E, MD, and ME have been revised.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 47/SC 47D
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2011-06-08 |
| Registration |
116207 |
| ICS-Code (International Standards Classification) |
31.080.01
|
| NBN Status |
New |
|
| IEC publication date |
2011-06-08 |
| IEC stability date |
2021-12-31 |
| IEC last modification date |
2019-01-10 |
|
