| Publication CODE |
Title |
| NBN EN 60191-6-22:2013 (2013-03) |
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
PART 6-22: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR SEMICONDUCTOR PACKAGES SILICON FINE-PITCH BALL GRID ARRAY AND SILICON FINE-PITCH LAND GRID ARRAY (S-FBGA AND S-FLGA) |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
25.00 €
|
3 P. |
Description
Provides the outline drawings and dimensions common to siliconbased package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
|
| Class |
C93
(TELECOMMUNICATIONS - ELECTRONIC PASSIVE ELECTRONIC COMPONENTS AND OPTICAL FIBRES (SEE ALSO C90))
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
Very important notice: 98% of the text of the NBN EN 55XXX,
NBN EN 6XXXX comes from the IEC text which is NOT included.
This text can be ordered here:
IEC 60191-6-22:2012.
For the series NBN EN 50XXX, the standards are however complete.
|
EN version
|
FR version
|
DE version
|
|
| Status |
Registered trilingual Belgian standard EN or FR or DE |
| Situation |
Currently active
|
|
| Committee |
TC 47/SC 47D
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2013-01-15 |
| NBN Approval |
2013-05-31 |
| Belgian Official Journal |
2013-06-20 |
| Registration |
136581 |
| ICS-Code (International Standards Classification) |
31.080.01
|
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2013-01-15 |
| Date of availability (d.a.v.) |
2013-03-15 |
| Date of announcement (d.o.a.) |
2013-04-15 |
| Date of publication (d.o.p.) |
2013-10-15 |
| Date of withdrawal former edition (d.o.w.) |
2016-01-15 |
|
