Publication CODE |
Title |
IEC 60749-19:2003 (2003-02) |
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 19: DIE SHEAR STRENGTH |
|
Price Excl. VAT |
Total number of pages, tables and drawings |
21.00 €
|
11. |
Description
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.
|
Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
Committee |
TC 47
SEMICONDUCTOR DEVICES
|
Responsible |
Ir DELENS Marc
|
BEC Approval |
2003-02-13 |
ICS-Code (International Standards Classification) |
31.080.01
|
|
IEC publication date |
2003-02-13 |
IEC stability date |
2025-12-31 |
IEC last modification date |
2018-11-22 |
|