| Publication CODE |
Title |
| IEC 63055:2023 (2023-10) |
FORMAT FOR LSI-PACKAGE-BOARD INTEROPERABLE DESIGN |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
451.00 €
|
292. |
Description
IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
Replaces
IEC 63055:2016
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2023-10-11 |
| ICS-Code (International Standards Classification) |
31.180
, 31.200
, 35.060
|
| NBN Status |
New |
|
| IEC publication date |
2023-10-11 |
| IEC stability date |
2028-12-31 |
| IEC file modification date |
2023-10-11 |
| IEC last modification date |
2023-10-11 |
|
