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Publication details

Publication CODE Title
IEC 63055:2023 (2023-10) FORMAT FOR LSI-PACKAGE-BOARD INTEROPERABLE DESIGN
 
Price Excl. VAT Total number of pages, tables and drawings
451.00 € 292.
Description
IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN version

Status
Status IEC PUBLICATION
Situation Currently active
Replaces  IEC 63055:2016
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2023-10-11
ICS-Code (International Standards Classification) 31.180 , 31.200 , 35.060
NBN Status New
IEC publication date 2023-10-11
IEC stability date 2028-12-31
IEC file modification date 2023-10-11
IEC last modification date 2023-10-11