| Publication CODE |
Title |
| NBN EN 60749-20:2010 (2009-11) |
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS
PART 20: RESISTANCE OF PLASTIC-ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
25.00 €
|
3 P. |
Description
Provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision.
The main changes are as follows:
- to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C;
- reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1;
- update for lead-free solder;
- correct certain errors in the original Edition 1.
|
| Class |
C86
(ELECTRONIC COMPONENTS MICRO ELECTRONICS - DISCRETE SEMICONDUCTORS)
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
Very important notice: 98% of the text of the NBN EN 55XXX,
NBN EN 6XXXX comes from the IEC text which is NOT included.
This text can be ordered here:
IEC 60749-20:2008.
For the series NBN EN 50XXX, the standards are however complete.
|
NL version
|
DE version
|
EN version
|
FR version
|
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2009-09-01 |
| NBN Approval |
2010-01-22 |
| Belgian Official Journal |
2010-02-18 |
| Registration |
105043 |
| ICS-Code (International Standards Classification) |
31.080.01
|
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2009-09-01 |
| Date of availability (d.a.v.) |
2009-11-26 |
| Date of announcement (d.o.a.) |
2009-12-01 |
| Date of publication (d.o.p.) |
2010-06-01 |
| Date of withdrawal former edition (d.o.w.) |
2012-09-01 |
|
