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Publication details

Publication CODE Title
IEC 61760-1:2006 (2006-04) SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
 
Price Excl. VAT Total number of pages, tables and drawings
201.00 € 30 P.
Description
IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The main changes with regard to the previous edition concern:
- requirements related to lead-free soldering;
- extension of the scope to include also components mounted by gluing;
- direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat;
- classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN version

EN/FR version

Status
Status IEC PUBLICATION
Situation Withdrawn
Replaced by  IEC 61760-1:2020
Replaces  IEC 61760-1:1998
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2006-04-10
ICS-Code (International Standards Classification) 31.240
IEC publication date 2006-04-10
IEC stability date 2020-12-31
IEC last modification date 2020-01-02