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Publication details

Publication CODE Title
IEC 60068-2-58:1989 (1989-08) ENVIRONMENTAL TESTING. PART 2: TESTS. TEST TD: SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
 
Price Excl. VAT Total number of pages, tables and drawings
85.00 € 25.
Description
Determines solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices. The procedure uses a solder bath and applies only to products designed to withstand short-term immersion in molten solder.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version
Status
Status IEC PUBLICATION
Situation Withdrawn
Replaced by  IEC 60068-2-58:1999
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 1989-08-15
Registration 156882
ICS-Code (International Standards Classification) 35.040
NBN Status New
IEC publication date 1989-08-15
IEC last modification date 2004-04-28