Publication CODE |
Title |
NBN EN 61189-5-3:2015 (2015-03) |
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES
PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
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Price Excl. VAT |
Total number of pages, tables and drawings |
25.00 €
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3 P. |
Description
Is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering.
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Class |
C
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Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
Very important notice: 98% of the text of the NBN EN 55XXX,
NBN EN 6XXXX comes from the IEC text which is NOT included.
This text can be ordered here:
IEC 61189-5-3:2015.
For the series NBN EN 50XXX, the standards are however complete.
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DE version
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EN version
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FR version
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Status |
Registered trilingual Belgian standard EN or FR or DE |
Situation |
Currently active
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Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
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Responsible |
De heer VAN HECKE Luk
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BEC Approval |
2015-02-12 |
NBN Approval |
2015-04-17 |
Belgian Official Journal |
2015-06-10 |
Registration |
157226 |
ICS-Code (International Standards Classification) |
31.180
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NBN Status |
New |
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Date of ratification (d.o.r.) |
2015-02-12 |
Date of availability (d.a.v.) |
2015-03-13 |
Date of announcement (d.o.a.) |
2015-05-12 |
Date of publication (d.o.p.) |
2015-11-12 |
Date of withdrawal former edition (d.o.w.) |
2018-02-12 |
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