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Publication details

Publication CODE Title
NBN EN IEC 61760-1:2020 (2020-10) SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
 
Price Excl. VAT Total number of pages, tables and drawings
16.00 € 4.
Description
IEC 61760-1:2020 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications. The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD component's general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology. Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses. This edition includes the following significant technical changes with respect to the previous edition: a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless interconnection.
Class  C
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally only available in English or French. Only the cover page is translated and the document itself is in English or in French.

DE version
EN version
FR version
Status
Status IEC PUBLICATION
Situation Currently active
Replaces  NBN EN 61760-1:2007
Origin
Committee CLC/SR 91
Electronics assembly technology
Approval
BEC Approval 2020-08-18
NBN Approval 2020-10-22
NBN Status New
Date of ratification (d.o.r.) 2020-08-18
Date of announcement (d.o.a.) 2020-11-18
IEC file modification date 2020-09-26