Publication CODE |
Title |
IEC 62137-1-2:2007 (2007-07) |
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST |
|
Price Excl. VAT |
Total number of pages, tables and drawings |
122.00 €
|
33. |
Description
The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.
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Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
Status |
IEC PUBLICATION |
Situation |
Currently active
|
|
Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
Responsible |
De heer VAN HECKE Luk
|
BEC Approval |
2007-07-14 |
ICS-Code (International Standards Classification) |
31.190
|
|
IEC publication date |
2007-07-25 |
IEC stability date |
2023-12-31 |
IEC last modification date |
2019-11-20 |
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