Publication CODE |
Title |
IEC 60191-6-18:2010 (2010-01) |
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA) |
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Price Excl. VAT |
Total number of pages, tables and drawings |
122.00 €
|
40. |
Description
IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition constitutes a technical revision.
The contents of the corrigenda of May 2010 and July 2010 have been included in this copy.
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Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
Committee |
TC 47/SC 47D
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
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Responsible |
Ir DELENS Marc
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Registration |
105144 |
ICS-Code (International Standards Classification) |
31.080.01
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NBN Status |
New |
|
IEC publication date |
2010-01-07 |
IEC stability date |
2020-12-31 |
IEC last modification date |
2010-08-10 |
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