| Publication CODE |
Title |
| IEC 61189-2-501:2022 (2022-02) |
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-501: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES - MEASUREMENT OF RESILIENCE STRENGTH AND RESILIENCE STRENGTH RETENTION FACTOR OF FLEXIBLE DIELECTRIC MATERIALS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
32. |
Description
IEC 61189-2-501:2022 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2022-02-03 |
| ICS-Code (International Standards Classification) |
31.180
|
| NBN Status |
New |
|
| IEC publication date |
2022-02-03 |
| IEC stability date |
2026-12-31 |
| IEC file modification date |
2022-02-03 |
| IEC last modification date |
2022-02-03 |
|
