Publication CODE |
Title |
NBN EN 61760-3:2010 (2010-04) |
SURFACE MOUNTING TECHNOLOGY
PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
|
Price Excl. VAT |
Total number of pages, tables and drawings |
25.00 €
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4 P. |
Description
Gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.
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Class |
C93
(TELECOMMUNICATIONS - ELECTRONIC PASSIVE ELECTRONIC COMPONENTS AND OPTICAL FIBRES (SEE ALSO C90))
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Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
Very important notice: 98% of the text of the NBN EN 55XXX,
NBN EN 6XXXX comes from the IEC text which is NOT included.
This text can be ordered here:
IEC 61760-3:2010.
For the series NBN EN 50XXX, the standards are however complete.
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EN version
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FR version
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DE version
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Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
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Responsible |
De heer VAN HECKE Luk
|
BEC Approval |
2010-04-01 |
NBN Approval |
2010-08-27 |
Belgian Official Journal |
2010-10-18 |
Registration |
107246 |
ICS-Code (International Standards Classification) |
31.190
|
NBN Status |
New |
|
Date of ratification (d.o.r.) |
2010-04-01 |
Date of availability (d.a.v.) |
2010-04-23 |
Date of announcement (d.o.a.) |
2010-07-01 |
Date of publication (d.o.p.) |
2011-01-01 |
Date of withdrawal former edition (d.o.w.) |
2013-04-01 |
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