| Publication CODE |
Title |
| IEC 63011-1:2018 (2018-11) |
INTEGRATED CIRCUITS - THREE DIMENSIONAL INTEGRATED CIRCUITS - PART 1: TERMINOLOGY |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
24. |
Description
IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47/SC 47A
INTEGRATED CIRCUITS
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2018-11-28 |
| ICS-Code (International Standards Classification) |
31.200
|
| NBN Status |
New |
|
| IEC publication date |
2018-11-28 |
| IEC stability date |
2024-12-31 |
| IEC file modification date |
2018-11-28 |
| IEC last modification date |
2018-11-28 |
|
