| Publication CODE |
Title |
| IEC 63011-2:2018 (2018-11) |
INTEGRATED CIRCUITS - THREE DIMENSIONAL INTEGRATED CIRCUITS - PART 2: ALIGNMENT OF STACKED DIES HAVING FINE PITCH INTERCONNECT |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
28. |
Description
IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47/SC 47A
INTEGRATED CIRCUITS
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2018-11-28 |
| ICS-Code (International Standards Classification) |
31.200
|
| NBN Status |
New |
|
| IEC publication date |
2018-11-28 |
| IEC stability date |
2024-12-31 |
| IEC file modification date |
2018-11-28 |
| IEC last modification date |
2018-12-19 |
|
