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Publication details

Publication CODE Title
IEC 60749-20:2008 (2008-12) SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
 
Price Excl. VAT Total number of pages, tables and drawings
201.00 € 53.
Description
IEC 60749-20:2008 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. The main changes are as follows:
- to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C;
- reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1;
- update for lead-free solder;
- correct certain errors in the original Edition 1.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Withdrawn
Replaced by  IEC 60749-20:2020
Replaces  IEC 60749-20:2002
Replaces  IEC 60749-20:2002/COR1:2003
Origin
Committee TC 47
SEMICONDUCTOR DEVICES
Responsible Ir DELENS Marc
Approval
BEC Approval 2008-12-09
Registration 126884
ICS-Code (International Standards Classification) 31.080.01
NBN Status New
IEC publication date 2008-12-09
IEC stability date 2022-12-31
IEC last modification date 2018-11-22