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Publication details

Publication CODE Title
IEC 61190-1-3:2007 (2007-04) ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
 
Price Excl. VAT Total number of pages, tables and drawings
249.00 € 71.
Description
IEC 61190-1-3:2007 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an amendment to Table B.1 concerning lead-free solder alloys.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

EN version

Status
Status IEC PUBLICATION
Situation Withdrawn
Replaced by  IEC 61190-1-3:2017
Replaces  IEC 61190-1-3:2002
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2007-04-01
ICS-Code (International Standards Classification) 31.190
IEC publication date 2007-04-26
IEC stability date 2018-12-31
IEC last modification date 2017-12-13