| Publication CODE |
Title |
| IEC 61760-1:2006 (2006-04) |
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
201.00 €
|
30 P. |
Description
IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The main changes with regard to the previous edition concern:
- requirements related to lead-free soldering;
- extension of the scope to include also components mounted by gluing;
- direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat;
- classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2006-04-10 |
| ICS-Code (International Standards Classification) |
31.240
|
|
| IEC publication date |
2006-04-10 |
| IEC stability date |
2020-12-31 |
| IEC last modification date |
2020-01-02 |
|
