| Publication CODE |
Title |
| NBN EN IEC 60749-30:2020 (2020-10) |
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
14.00 €
|
3. |
Description
IEC 60749-30:2020 is available as IEC 60749-30:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition:
- inclusion of new Clause 3;
- expansion of 6.7 on solder reflow;
- inclusion of explanatory notes and clarifications.
|
| Class |
C
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
|
DE version
|
EN version
|
FR version
|
|
| Committee |
CLC/SR 47
Semiconductor devices
|
| BEC Approval |
2020-09-21 |
| NBN Approval |
2020-10-22 |
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2020-09-21 |
| Date of announcement (d.o.a.) |
2020-12-21 |
| IEC file modification date |
2020-09-26 |
|
