| Publication CODE |
Title |
| IEC PAS 60191-6-18:2008 (2008-01) |
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA) |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
122.00 €
|
19. |
Description
This PAS provides common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or larger and whose package body outline is square.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 47/SC 47D
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2008-01-22 |
| ICS-Code (International Standards Classification) |
35.040
|
|
| IEC publication date |
2008-01-22 |
| IEC last modification date |
2010-01-07 |
|
