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Publication details

Publication CODE Title
IEC 62148-21:2019 (2019-03) FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PACKAGE AND INTERFACE STANDARDS - PART 21: DESIGN GUIDE OF ELECTRICAL INTERFACE OF PIC PACKAGES USING SILICON FINE-PITCH BALL GRID ARRAY (S-FBGA) AND SILICON FINE-PITCH LAND GRID ARRAY (S-FLGA)
 
Price Excl. VAT Total number of pages, tables and drawings
85.00 € 25.
Description
IEC 62148-21:2019 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.
Keywords: electrical interface of photonic integrated circuit (PIC) packages
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Withdrawn
Replaced by  IEC 62148-21:2021
Origin
Committee TC 86/SC 86C
FIBRE OPTIC SYSTEMS AND ACTIVE DEVICES
Responsible Monsieur POLART Jules, Ingénieur
Chaussée de Brunehault, 380
7140  MORLANWELZ
Phone: 064 / 45 16 83
Fax: 064 / 45 16 83
E-mail: jules.polart@ceb-bec.be
Approval
BEC Approval 2019-03-11
ICS-Code (International Standards Classification) 33.180.20
NBN Status New
IEC publication date 2019-03-11
IEC stability date 2021-12-31
IEC file modification date 2019-03-11
IEC last modification date 2020-04-07