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Publication details

Publication CODE Title
IEC 61189-3:2007 (2007-10) TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
 
Price Excl. VAT Total number of pages, tables and drawings
398.00 € 241 P.
Description
IEC 61189-3:2007 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major technical changes with regard to the previous edition concern the addition of 25 new tests, as follows:
- 6 V: Visual test methods: 3V01, 3V02 and 3V03;
- 7 D: Dimensional test methods: 3D03;
- 8 C: Chemical test methods: 3C02, 3C13 and 3C14;
- 9 M: Mechanical test methods: 3M01, 3M03, 3M04, 3M07 and 3M09;
- 10 E: Electrical test methods: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 and 3E18;
- 11 N: Environmental test methods: 3N03, 3N07 and 3N12;
- 12 X: Miscellaneous test methods: 3X01.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN version

EN/FR version

Status
Status IEC PUBLICATION
Situation Currently active
Replaces  IEC 61189-3:1997
Replaces  IEC 61189-3:1997+AMD1:1999 CSV
Replaces  IEC 61189-3:1997/AMD1:1999
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2007-10-09
ICS-Code (International Standards Classification) 31.180
IEC publication date 2007-10-09
IEC stability date 2023-12-31
IEC last modification date 2019-11-20