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Publication details

Publication CODE Title
IEC 62878-2-5:2019 (2019-09) DEVICE EMBEDDING ASSEMBLY TECHNOLOGY - PART 2-5: GUIDELINES - IMPLEMENTATION OF A 3D DATA FORMAT FOR DEVICE EMBEDDED SUBSTRATE
 
Price Excl. VAT Total number of pages, tables and drawings
318.00 € 53.
Description
IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.
This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers.
IEC 62878-2-5:2019 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN version

Status
Status IEC PUBLICATION
Situation Currently active
Replaces  IEC PAS 62878-2-5:2015
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2019-09-16
ICS-Code (International Standards Classification) 31.180 , 31.190
NBN Status New
IEC publication date 2019-09-16
IEC stability date 2026-12-31
IEC file modification date 2019-09-16
IEC last modification date 2020-01-20