| Publication CODE |
Title |
| IEC TR 60068-3-12:2007 (2007-03) |
ENVIRONMENTAL TESTING
PART 3-12: SUPPORTING DOCUMENTATION AND GUIDANCE - METHOD TO EVALUATE A POSSIBLE LEAD-FREE SOLDER REFLOW TEMPERATURE PROFILE |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
16 P. |
Description
Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components)
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2007-03-12 |
| ICS-Code (International Standards Classification) |
19.040
|
|
| IEC publication date |
2007-03-12 |
| IEC stability date |
2013-12-31 |
| IEC last modification date |
2014-10-17 |
|
