| Publication CODE |
Title |
| IEC 62148-21:2019 (2019-03) |
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PACKAGE AND INTERFACE STANDARDS - PART 21: DESIGN GUIDE OF ELECTRICAL INTERFACE OF PIC PACKAGES USING SILICON FINE-PITCH BALL GRID ARRAY (S-FBGA) AND SILICON FINE-PITCH LAND GRID ARRAY (S-FLGA) |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
25. |
Description
IEC 62148-21:2019 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.
Keywords: electrical interface of photonic integrated circuit (PIC) packages
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 86/SC 86C
FIBRE OPTIC SYSTEMS AND ACTIVE DEVICES
|
| Responsible |
Monsieur POLART Jules, Ingénieur
Chaussée de Brunehault, 380
7140
MORLANWELZ
Phone: 064 / 45 16 83
Fax: 064 / 45 16 83
E-mail: jules.polart@ceb-bec.be
|
| BEC Approval |
2019-03-11 |
| ICS-Code (International Standards Classification) |
33.180.20
|
| NBN Status |
New |
|
| IEC publication date |
2019-03-11 |
| IEC stability date |
2021-12-31 |
| IEC file modification date |
2019-03-11 |
| IEC last modification date |
2020-04-07 |
|
