| Publication CODE |
Title |
| IEC 61191-3:1998 (1998-08) |
PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
31. |
Description
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
1998-08-28 |
| ICS-Code (International Standards Classification) |
31.240
|
|
| IEC publication date |
1998-08-28 |
| IEC stability date |
2017-12-31 |
| IEC last modification date |
2017-05-30 |
|
