| Publication CODE |
Title |
| IEC 62047-10:2011 (2011-07) |
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 10: MICRO-PILLAR COMPRESSION TEST FOR MEMS MATERIALS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
42.00 €
|
22 P. |
Description
IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials. The contents of the corrigendum of February 2012 have been included in this copy.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47/SC 47F
MICRO-ELECTROMECHANICAL SYSTEMS
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2011-07-26 |
| Registration |
116392 |
| ICS-Code (International Standards Classification) |
31.080.99
|
| NBN Status |
New |
|
| IEC publication date |
2011-07-26 |
| IEC stability date |
2023-12-31 |
| IEC last modification date |
2018-10-31 |
|
