| Publication CODE |
Title |
| NBN EN 62047-9:2011 (2011-08) |
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES
PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
25.00 €
|
3 P. |
Description
Describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable wafer thickness is in the range of 10 ìm to several millimeters.
|
| Class |
C96
(TELECOMMUNICATIONS - ELECTRONIC MICRO ELECTRONICS - DISCRETE SEMICONDUCTOR DEVICES)
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
Very important notice: 98% of the text of the NBN EN 55XXX,
NBN EN 6XXXX comes from the IEC text which is NOT included.
This text can be ordered here:
IEC 62047-9:2011.
For the series NBN EN 50XXX, the standards are however complete.
|
EN version
|
FR version
|
DE version
|
|
| Status |
Registered trilingual Belgian standard EN or FR or DE |
| Situation |
Currently active
|
|
| Committee |
TC 47/SC 47F
MICRO-ELECTROMECHANICAL SYSTEMS
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2011-08-17 |
| NBN Approval |
2011-10-21 |
| Belgian Official Journal |
2011-11-29 |
| Registration |
116989 |
| ICS-Code (International Standards Classification) |
31.080.99
|
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2011-08-17 |
| Date of availability (d.a.v.) |
2011-08-19 |
| Date of announcement (d.o.a.) |
2011-11-17 |
| Date of publication (d.o.p.) |
2012-05-17 |
| Date of withdrawal former edition (d.o.w.) |
2014-08-17 |
|
