| Publication CODE |
Title |
| IEC 62047-18:2013 (2013-07) |
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
26 P. |
Description
IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47/SC 47F
MICRO-ELECTROMECHANICAL SYSTEMS
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2013-07-17 |
| ICS-Code (International Standards Classification) |
31.080.99
|
| NBN Status |
New |
|
| IEC publication date |
2013-07-17 |
| IEC stability date |
2022-12-31 |
| IEC file modification date |
2013-07-16 |
| IEC last modification date |
2017-11-15 |
|
